Rogers RO4350B Design Tool

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About Rogers RO4350B

RO4350B is a glass-reinforced hydrocarbon/ceramic laminate designed for high-performance RF applications. It offers excellent electrical performance at competitive prices, with a tightly controlled dielectric constant (Dk) of 3.48 ±0.05, low loss, and excellent stability across frequency and temperature ranges.

Key Electrical Properties

3.48
Dielectric Constant (Dk)
@ 10 GHz, Process
0.0037
Loss Tangent (Df)
@ 10 GHz
1.67
Thermal Conductivity
W/m/K
280°C
Td (Decomposition)
TGA @ 5% wt loss
14
CTE (X-axis)
ppm/°C
46
CTE (Z-axis)
ppm/°C
Mechanical Properties
Structural specifications
Peel Strength (1 oz)6 lb/in
Flexural Strength276 MPa
Density1.86 g/cm³
Moisture Absorption0.06%
FlammabilityUL 94 V-0
Available Thicknesses
Standard laminate options
6.6
mil (0.168mm)
10
mil (0.254mm)
20
mil (0.508mm)
30
mil (0.762mm)
60
mil (1.524mm)
Key Advantages
Why choose RO4350B
  • FR-4 compatible processing
  • Excellent Dk tolerance (±0.05)
  • Low Z-axis CTE
  • Lead-free process compatible
  • CAF resistant
Microstrip Impedance
Single-ended transmission line
mil
mil
mil
Characteristic Impedance (Z₀)
50.2Ω
Stripline Impedance
Embedded transmission line
mil
mil
mil
Characteristic Impedance (Z₀)
49.8Ω
Differential Pair
Edge-coupled microstrip
mil
mil
mil
Differential Impedance (Zdiff)
100.4Ω

Calculation Notes

These calculations use simplified approximations for quick estimates. For production designs, please use a field solver or request accurate stack-up data from your PCB manufacturer. Results are based on RO4350B's typical Dk of 3.48 at 10 GHz.

Stack-up Configuration
Design your RO4350B layer structure
Solder Mask
~0.5 mil green
Layer 1 (Top Signal)
1 oz copper (1.4 mil)
RO4350B Core
10 mil, Dk=3.48
Layer 2 (Ground)
1 oz copper (1.4 mil)
RO4450F Prepreg
4 mil, Dk=3.52
Layer 3 (Power)
1 oz copper (1.4 mil)
RO4350B Core
10 mil, Dk=3.48
Layer 4 (Bottom Signal)
1 oz copper (1.4 mil)
Solder Mask
~0.5 mil green
Stack-up Summary
Calculated parameters
Total Thickness62.8 mil
Dielectric Thickness (L1-L2)10 mil
Prepreg Thickness4 mil
Effective Dk (avg)3.50
Recommended forUp to 20 GHz
Compatible Prepregs
Rogers bonding materials
RO4450FDk 3.52, 4 mil
RO4450BDk 3.54, 4 mil
RO4403Dk 3.17, 3 mil

💡 RO4450F is recommended for hybrid builds with RO4350B core for optimal Dk matching.

Thermal Resistance Calculator
Estimate heat dissipation performance
mm²
mm
W/mK
Thermal Resistance (Rth)
3.68°C/W
Temperature Rise Estimator
Based on power dissipation
W
°C
°C/W
Estimated Junction Temperature
32.4°C
RO4350B Thermal Properties
Material specifications
Thermal Conductivity0.69 W/mK
Tg (Glass Transition)>280°C
Td (Decomposition)390°C
CTE (X, Y)14 ppm/°C
CTE (Z)46 ppm/°C
Max Operating Temp-40 to +85°C

Thermal Design Tips

  • Use thermal vias under high-power components to improve heat transfer to ground planes
  • RO4350B's relatively low thermal conductivity (0.69 W/mK) compared to alumina requires careful thermal management
  • Consider metal-backed laminates for high-power RF applications
  • The low Z-axis CTE (46 ppm/°C) provides excellent reliability for thermal cycling

Ideal Application Frequency Range

Rogers RO4350B is optimized for applications from DC to 20+ GHz. Its tight Dk tolerance (±0.05) and low loss tangent (0.0037) make it ideal for demanding RF/microwave circuits where phase consistency and signal integrity are critical.

Industry Applications

5G/LTE Base Stations

Power amplifiers, filters, and antenna feed networks requiring stable performance across temperature variations.

700 MHz - 6 GHz

Automotive Radar

77GHz ADAS radar sensors for collision avoidance, adaptive cruise control, and autonomous driving systems.

24 GHz / 77 GHz

Satellite Communications

LNBs, block upconverters, and ground station equipment for VSAT and broadcast satellite systems.

Ku/Ka Band

Wireless Infrastructure

WiFi 6/6E access points, small cells, and distributed antenna systems for enterprise and industrial IoT.

2.4 / 5 / 6 GHz

Power Amplifiers

GaN and LDMOS PA designs for cellular, broadcast, and military communications requiring high thermal stability.

DC - 6 GHz

Test & Measurement

Calibration boards, probe cards, and reference standards requiring consistent and repeatable performance.

DC - 20+ GHz

Why Engineers Choose RO4350B

  • Cost-effective: Significantly lower cost than PTFE-based materials while maintaining excellent RF performance
  • FR-4 Processing: Can be fabricated using standard FR-4 processes, reducing manufacturing costs
  • Tight Tolerance: ±0.05 Dk tolerance enables accurate impedance control without field solver adjustments
  • Thermal Stability: Low TCDk ensures consistent performance across operating temperature range
  • Lead-Free Compatible: Supports high-temperature reflow processes required for RoHS compliance

RO4350B Cost Estimation Tool

Get a preliminary cost estimate for your RO4350B PCB project. Actual pricing depends on specifications, quantity, lead time, and current material availability. For accurate quotes, please use the "Request Quote" button.

Project Specifications
Enter your PCB requirements
mm
mm
Cost Breakdown Estimate
Preliminary pricing (actual may vary)
Item Description Est. Cost
RO4350B Material 4-layer, 10 mil core $85.00
Fabrication Standard processing $45.00
Surface Finish ENIG $25.00
Testing E-test, visual inspection $15.00
Estimated Total 10 pcs @ 100×80mm $170.00
Get Accurate Quote Now

Important Notes

  • RO4350B typically costs 3-5x more than standard FR-4 but significantly less than PTFE materials
  • Minimum order quantities may apply for certain thicknesses and configurations
  • Complex designs (fine pitch, blind/buried vias, tight tolerances) will affect pricing
  • Material availability can impact lead times - early engagement recommended for production volumes

High-Frequency PCB Material Comparison

Compare RO4350B with other popular RF/microwave PCB materials to select the best option for your application requirements.

Property RO4350B RO4003C FR-4 RT/duroid 5880 Megtron 6
Dk @ 10GHz 3.48 3.38 4.2-4.5 2.20 3.4
Df @ 10GHz 0.0037 0.0027 0.02 0.0009 0.002
Dk Tolerance ±0.05 ±0.05 ±0.3 ±0.02 ±0.05
Thermal Conductivity 0.69 W/mK 0.71 W/mK 0.3 W/mK 0.20 W/mK 0.4 W/mK
CTE (Z-axis) 46 ppm 46 ppm 70 ppm 237 ppm 25 ppm
FR-4 Processing Yes Yes Yes No (PTFE) Yes
Relative Cost $$ $$ $ $$$$ $$$
Max Frequency 20+ GHz 20+ GHz ~3 GHz 77+ GHz 25 GHz
Best For Cost-effective RF Low-loss RF Low-freq digital mmWave/space High-speed digital
When to Choose RO4350B
Ideal use cases
  • Applications up to 20 GHz requiring good RF performance
  • Cost-sensitive projects needing better than FR-4 performance
  • Mixed-signal designs combining RF and digital sections
  • Production volumes where PTFE processing costs are prohibitive
Consider Alternatives When
RO4350B limitations
  • ! mmWave applications (77+ GHz) - consider RT/duroid
  • ! Ultra-low loss requirements - consider RO4003C or PTFE
  • ! Very high-speed digital (112G PAM4) - consider Megtron 7
  • ! Budget-constrained low-frequency designs - FR-4 may suffice